Injection Mold Defect & Deformation Case Studies | Topworks

Case Studies

Case Study 1: Side Wall Deformation Control #

Measured correction to eliminate assembly risk before mass production.

Dimensional Risk
#
Defect
Side wall deformation (measured out of tolerance)
Fix
Tooling-level correction + process window tuning
Outcome
Deformation reduced and verified; stable repeatable production
#
Before: side wall deformation measurement showing the deformation risk area
Before#
Measured side wall deformation created assembly/tolerance risk.
After: deformation reduced and verified on the battery box compartments
After#
Deformation reduced and verified within the target tolerance window.

Issue #

Side wall deformation caused fitment and tolerance risk during assembly.

Root Cause #

Differential shrink + stress release after ejection, amplified by geometry and cooling imbalance.

Fix #

Measured deformation → tooling correction (support/slider/core) + refined packing/cooling window.

#Result: Deformation reduced and verified to meet customer requirement; production stabilized.
#Process note: Use a controlled packing/cooling window and verify repeatability with dimensional check after full cool-down.

Case Study 2: Flash Defect Elimination #

Structural reinforcement + sealing verification to permanently eliminate flash.

Flash
#
Defect
Flash at parting line / edge area
Fix
Added support pillars + verified parting-line contact
Outcome
Flash eliminated; stable production and shipment
#
Before: flash defect along parting line on a large grid molded product
Before#
Flash observed along parting line during sampling.
Finding: insufficient internal support pillars causing mold deflection under pressure
Finding#
Large mold deflection risk due to insufficient internal support.
Fix: mold modification adding support pillars and verifying parting line contact
Fix#
Added pillars + parting line verification to restore sealing.
Result: approved production and shipment after flash elimination
Result#
Flash eliminated; production approved and shipped.

Issue #

Flash increased trimming/scrap and created sharp edge & cosmetic risk.

Root Cause #

Large mold deflection under injection pressure due to insufficient support pillars.

Fix #

Added support pillars + verified parting-line contact to restore sealing under pressure.

#Result: Flash eliminated and verified; production stabilized and shipped.
#Process note: Keep clamp & packing profile stable; avoid pressure spikes that can reopen weak shut-off regions.

Case Study 3: Internal Bubble Elimination (Thick-Wall Transparent PC) #

Process tuning + fan-gate freeze-time verification to eliminate internal voids in a transparent PC thick-wall area.

Optical Risk
#
Defect
Internal bubble / vacuum void (inside thick section)
Fix
Higher mold temp + optimized packing profile (fan gate)
Outcome
Void eliminated, stable repeatable production
#
Thick wall transparent PC injection molded part showing high risk area for internal void formation
Geometry#
Thick-wall transparent PC section. Differential cooling risk is high in the thick area.
Internal bubble inside thick wall transparent PC injection molded part caused by center shrinkage
Before#
Internal bubble observed in the thick section (surface may look OK, void is inside).
Transparent PC injection molded part without internal bubbles after process optimization
After#
No internal bubble after thermal + packing optimization (material unchanged).
Before and after comparison of internal bubble elimination in thick wall PC injection molding
Comparison#
Before/after verification: internal bubbles eliminated in thick-wall areas.

Issue #

Internal bubbles appeared during sampling in the thick-wall transparent area, creating optical rejection risk.

Root Cause #

Outer skin froze early while the core continued to shrink; packing window was insufficient for the thick section.

Fix #

Increase mold temperature and optimize packing profile using fan-gate freeze-time verification.

#Result: Internal voids eliminated and production stabilized.
#Process settings (verified on-site): Material PC · Fan gate thickness 3–4mm · Melt 300°C · Mold 110°C · High injection speed · Packing pressure ~100 MPa · Packing time up to 60s (validated)